寒武纪 IPO 披露问询回复：除募集资金外 3 年内仍需 30-36 亿元投入芯片研发

寒武纪 IPO 披露问询回复：除募集资金外 3 年内仍需 30-36 亿元投入芯片研发
根据寒武纪披露的回复显示，上交所共提出了 6 大类 20 个问题，涉及公司核心技术、研发项
目、募投项目、应收账款等诸多问题 … 对于寒武纪的募投项目市场关注度最高，根据申报材
料，寒武纪报告期末货币资金、银行理财产品共计约 43 亿元，本次发行拟募集资金 28 亿元，
19 亿元用于新一代云端训练芯片、推理芯片、边缘人工智能芯片及系统项目，9 亿元用于补
充流动资金 … 对此，上交所要求寒武纪说明当前自有资金足以覆盖在研项目及募投项目资金
需求的情况下，本次发行募集资金的必要性，对现有资金的预算规划。
Reply to the inquiry on the disclosure of Cambrian IPO: in addition to the raised funds, 3-3.6 billion yuan is still needed for chip R & D in three years
According to the reply of Cambrian disclosure, Shanghai Stock Exchange raised 6 categories and 20 questions, involving the company’s core technology and R & D projects
Items, raised investment projects, accounts receivable and many other issues… For the Cambrian raised investment projects, the market has the highest attention, according to the application materials
It is expected that at the end of the Cambrian report period, monetary funds and bank financial products totaled about 4.3 billion yuan, and 2.8 billion yuan will be raised in this issue,
1.9 billion yuan for new generation cloud training chip, reasoning chip, edge artificial intelligence chip and system projects, and 900 million yuan for compensation
For this, the Shanghai stock exchange requires Cambrian to explain that the current self owned funds are enough to cover the funds for research projects and projects funded by raised funds
In case of demand, it is necessary to raise funds for this issuance and make budget planning for existing funds.